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منتجات جديدة

Best thermally conductive substrates: thick film silver layer on aluminum nitride, or DBC (directed

bonded copper) on aluminum nitride that enable the high-power density;

-  Eutectic soldering process instead of silver epoxy for die attach, improving thermal conductivity;

-  Good brand of UV chips that have been tested reliable with good statistics;

four wavelength ranges: 360 - 370nm; 380 – 390nm; 390 – 400nm; 400 – 410nm.

-  Thermally stable and UV stable silicone for encapsulation that were selected based on extensive

experimental test data.


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