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Gold Layer Peeling Machine

2026-05-25 15:03:43

Custom 4-Inch Wafer Gold Layer Peeling Machine

Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications.

This is a new product recently developed by our company, and both manual and semi-automatic can be customized.

NO

parameter

Name

Crystal stripping machine

Model

DSX-26-049

Size of Wafer

4 inch

Table

4 inch ×6 pcsd,With a groove

Fixed Mode

Vac-sorb

Material quality

Aluminum Material

Surface preparation

Oxide hardening

Operate mode

Manual

Air pressure

0.6–0.8Mpa

Physical dimension

1010×498×347mm(Length × Width × Height)

location mode

Notch positioning

Heating System

Obligate

Manufacturer

DSXUV/Guang dong Spacelight Electronics Co., Ltd



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